New Vertiv™ CoolLoop Trim Cooler enhances efficiency, reduces space, and supports fluctuating water temperatures for high-density environments
Vertiv has launched the Vertiv CoolLoop Trim Cooler, a next-generation heat rejection system designed to optimize hybrid liquid and air cooling for AI and high-performance computing (HPC) applications.
“AI is transforming data center operations, demanding smarter, more efficient cooling solutions,” said Sam Bainborough, Vice President, Thermal Business EMEA at Vertiv. “The CoolLoop Trim Cooler is engineered to handle high-density workloads while dramatically reducing energy consumption and space requirements.”
This compact and energy-efficient cooling system can reduce annual cooling energy consumption by up to 70% and requires 40% less space than traditional solutions. Designed to support fluctuating water temperatures up to 40°C, it integrates smoothly with direct-to-chip and immersion cooling systems, ensuring adaptability for AI-driven data centers.
The Vertiv CoolLoop Trim Cooler also complies with 2027 EU F-GAS regulations, minimizing CO2e emissions and eliminating the need for costly infrastructure upgrades in the future.
