New CoolChip CDU 2300 and Fluid Network Row Manifolds strengthen end-to-end thermal management for high-density AI infrastructure
Vertiv has expanded its liquid cooling portfolio across Europe, the Middle East, and Africa (EMEA) with the launch of the Vertiv CoolChip CDU 2300 and Vertiv CoolChip Fluid Network Row Manifolds, aimed at supporting the growing demand for AI-ready and high-density data center infrastructure.
The new solutions strengthen Vertiv’s end-to-end thermal management portfolio, enabling organizations to deploy advanced AI computing environments more efficiently while addressing increasing power and cooling requirements associated with next-generation workloads.
The announcement comes as enterprises and hyperscale operators continue to invest heavily in AI infrastructure, creating a need for more efficient cooling technologies capable of handling significantly higher rack densities than traditional air-cooled environments.
At the center of the launch is the Vertiv CoolChip CDU 2300, a liquid-to-liquid coolant distribution unit that delivers up to 2.3 MW of cooling capacity within a compact footprint. According to Vertiv, the solution offers one of the industry’s highest capacity-to-footprint ratios, enabling operators to maximize data center space utilization while reducing the number of cooling units required for large-scale deployments.
“The rapid growth of AI workloads is driving a fundamental shift in how data centers are designed, cooled, powered and operated. We are expanding our end-to-end portfolio to help customers deploy AI-ready infrastructure faster and operate more efficiently over time.”
— Paul Ryan, President, EMEA, Vertiv
The CDU supports both direct-to-chip liquid cooling and rear-door heat exchanger technologies. It incorporates intelligent controls that dynamically adjust coolant flow and temperature based on workload demands, helping improve efficiency while maintaining optimal thermal performance.
Complementing the CDU is the new Vertiv CoolChip Fluid Network Row Manifolds solution, which serves as the connectivity layer between coolant distribution systems, server-level cooling infrastructure, and heat rejection equipment. The modular design supports direct-to-chip cooling, immersion cooling, and rear-door heat exchanger deployments, simplifying liquid cooling integration for both new facilities and retrofit projects.
“The rapid growth of AI workloads is driving a fundamental shift in how data centers are designed, cooled, powered and operated,” said Paul Ryan, President of Vertiv EMEA. “Our expanded portfolio combines liquid cooling, power infrastructure, intelligent controls, and lifecycle services to help customers deploy AI-ready infrastructure faster and operate more efficiently.”
Vertiv noted that the new solutions form part of its broader thermal chain strategy, which integrates cooling technologies, heat rejection systems, intelligent controls, and support services into a unified architecture. The company believes this holistic approach will help organizations address the increasing thermal challenges associated with AI, high-performance computing, and next-generation digital infrastructure while improving operational efficiency and scalability.
