Vertiv has announced a major expansion of its liquid cooling portfolio with the launch of three new CoolChip CDU (coolant distribution unit) models—CDU 70, CDU 100, and CDU 600—now available across EMEA. These cutting-edge direct-to-chip (DTC) solutions are designed to help data centers meet the rising thermal demands of high-density AI and high-performance computing (HPC) workloads.
With enterprises racing to deploy AI at scale, cooling infrastructure must evolve. “Customers need liquid cooling solutions that adapt to their unique deployment strategies, whether retrofitting an existing environment or scaling a new build,” said Sam Bainborough, VP of EMEA Thermal Business at Vertiv. “The Vertiv CoolChip CDU family simplifies deployment, supports long-term growth, and reduces integration complexity.”
“As AI and HPC workloads push the limits of data center capacity, scalable liquid cooling is no longer optional—it’s strategic.”
— Sam Bainborough, VP, EMEA Thermal Business, Vertiv
The new offerings address a range of data center needs:
- Vertiv™ CoolChip CDU 70 offers 70 kW liquid-to-air cooling in an in-row form factor—ideal for retrofits and fast-track deployments.
- Vertiv™ CoolChip CDU 100 delivers 100 kW of high-efficiency, in-rack liquid-to-liquid cooling, suited for secure AI pilot programs and incremental growth.
- Vertiv™ CoolChip CDU 600 brings hyperscale performance with 600 kW of cooling, engineered for colocation and large AI clusters.
All models feature integrated monitoring and advanced control for thermal performance, reliability, and scalability. The CDUs are supported by Vertiv™ Liquid Cooling Services, offering end-to-end support from design to maintenance.
This launch is part of Vertiv’s broader 360AI portfolio—positioning the company as a key enabler of AI infrastructure in the data center era. The CDU 600 will debut live at Datacloud Global Congress in Cannes.
